Technical Manager for Numerical Analysis/Methodology Development

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X // Select all anchor elements that have a jobId in their href const anchors = document.querySelectorAll('.custom-links a[href*="jobId="]'); const URLSource = window.location.href.match(/source=([^&]+)/)[1]; const URLTags = window.location.href.match(/tags=([^&]+)/)[1]; // Loop through each matching anchor element anchors.forEach(anchor => { // Get the current href of the anchor const href = anchor.getAttribute('href'); // Extract the jobId using a regular expression const jobIdMatch = href.match(/jobId=(\d+)/); const hasCareersPath = href.match(/\/careers\//); if (jobIdMatch) { const jobId = jobIdMatch[1]; // Capture the jobId value // Construct the new href with the extracted jobId const newHrefStart = anchor.getAttribute("href").split("?")[0], newHref = newHrefStart + `?jobId=${jobId}&source=${URLSource}&tags=${URLTags}`; // Set the new href attribute anchor.setAttribute('href', newHref); } }); { "@context": "http://schema.org", "@type": "JobPosting", "datePosted": null, "description": "\u003Cdiv\u003E1.\tLead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.\u003C\/div\u003E\u003Cdiv\u003E2.\tSupport the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. \u003C\/div\u003E\u003Cdiv\u003E3.\tCollaborate with EDA\/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.\u003C\/div\u003E", "employmentType": ["Regular"], "hiringOrganization" : { "@type": "Organization", "name": "TSMC - Taiwan Semiconductor Manufacturing Company Limited", "url": "https://careers.tsmc.com/en_US/careers", "logo": "https://careers.tsmc.com/_cms/6/image/logoHiringOrganization/1?version=269513", "sameAs": "https:\/\/www.tsmc.com\/english" }, "identifier": { "value": 7197, "@type": "PropertyValue" }, "jobLocation" : { "@type": "Place", "address": { "streetAddress": "Taiwan", "@type": "PostalAddress" } }, "educationRequirements": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "experienceRequirements": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "workHours": "\u003Cdiv\u003E1.\tLead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.\u003C\/div\u003E\u003Cdiv\u003E2.\tSupport the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. \u003C\/div\u003E\u003Cdiv\u003E3.\tCollaborate with EDA\/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.\u003C\/div\u003E", "qualifications": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "responsibilities": "\u003Cdiv\u003E1.\tLead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.\u003C\/div\u003E\u003Cdiv\u003E2.\tSupport the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. \u003C\/div\u003E\u003Cdiv\u003E3.\tCollaborate with EDA\/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.\u003C\/div\u003E", "skills": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "title" : "Technical Manager for Numerical Analysis\/Methodology Development" }

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X // Select all anchor elements that have a jobId in their href const anchors = document.querySelectorAll('.custom-links a[href*="jobId="]'); const URLSource = window.location.href.match(/source=([^&]+)/)[1]; const URLTags = window.location.href.match(/tags=([^&]+)/)[1]; // Loop through each matching anchor element anchors.forEach(anchor => { // Get the current href of the anchor const href = anchor.getAttribute('href'); // Extract the jobId using a regular expression const jobIdMatch = href.match(/jobId=(\d+)/); const hasCareersPath = href.match(/\/careers\//); if (jobIdMatch) { const jobId = jobIdMatch[1]; // Capture the jobId value // Construct the new href with the extracted jobId const newHrefStart = anchor.getAttribute("href").split("?")[0], newHref = newHrefStart + `?jobId=${jobId}&source=${URLSource}&tags=${URLTags}`; // Set the new href attribute anchor.setAttribute('href', newHref); } }); { "@context": "http://schema.org", "@type": "JobPosting", "datePosted": null, "description": "\u003Cdiv\u003E1.\tLead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.\u003C\/div\u003E\u003Cdiv\u003E2.\tSupport the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. \u003C\/div\u003E\u003Cdiv\u003E3.\tCollaborate with EDA\/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.\u003C\/div\u003E", "employmentType": ["Regular"], "hiringOrganization" : { "@type": "Organization", "name": "TSMC - Taiwan Semiconductor Manufacturing Company Limited", "url": "https://careers.tsmc.com/en_US/careers", "logo": "https://careers.tsmc.com/_cms/6/image/logoHiringOrganization/1?version=269513", "sameAs": "https:\/\/www.tsmc.com\/english" }, "identifier": { "value": 7197, "@type": "PropertyValue" }, "jobLocation" : { "@type": "Place", "address": { "streetAddress": "Taiwan", "@type": "PostalAddress" } }, "educationRequirements": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "experienceRequirements": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "workHours": "\u003Cdiv\u003E1.\tLead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.\u003C\/div\u003E\u003Cdiv\u003E2.\tSupport the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. \u003C\/div\u003E\u003Cdiv\u003E3.\tCollaborate with EDA\/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.\u003C\/div\u003E", "qualifications": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "responsibilities": "\u003Cdiv\u003E1.\tLead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.\u003C\/div\u003E\u003Cdiv\u003E2.\tSupport the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. \u003C\/div\u003E\u003Cdiv\u003E3.\tCollaborate with EDA\/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.\u003C\/div\u003E", "skills": "\u003Cdiv\u003E1.\tExcellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.\u003C\/div\u003E\u003Cdiv\u003E2.\tMaster's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.\u003C\/div\u003E\u003Cdiv\u003E3.\tFamiliar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.\u003C\/div\u003E\u003Cdiv\u003E4.\tExperience with Python scripting, C++\/C programming languages and high-performance computing libraries (GPU\/CUDA, Open MPI, OpenCL) is a plus.\u003C\/div\u003E", "title" : "Technical Manager for Numerical Analysis\/Methodology Development" }

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology. Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Manager / Executive Employment Type Regular Posted Mar 18, 2026

Company Taiwan Semiconductor Manufacturing Company Limited

Company

Taiwan Semiconductor Manufacturing Company Limited

Location Taiwan

Location

Taiwan

Career Area R&D Advanced Packaging Technology Development

Career Area

R&D Advanced Packaging Technology Development

Job Type Manager / Executive

Job Type

Manager / Executive

Employment Type Regular

Employment Type

Regular

Posted Mar 18, 2026

Posted

Mar 18, 2026

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.

Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.

Job Responsibilities 1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.

Job Responsibilities

1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.

1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.

2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers.

3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.

Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus.

Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus.

Job Qualifications 1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus.