Staff Engineer, Package Reliability

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions.

This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliability test results.

You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts in the GQ department related to package qualification and GCP failures. You will prepare reports to discuss and address critical issues. You will also engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation.

Successful candidate for this position will have:

• Detailed knowledge of semiconductor component package assembly processes and challenges in particularly HBM and 3DS packages.
• Understanding of mechanical and material interaction effects on reliability of IC components specifically used in 3DS packaging.
• Good understanding of the effects thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability
• A proven understanding of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred.
• Must be self-motivated, able to work independently, and detail oriented.
• Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups.
• Good written and interpersonal skills, digital literacy are vital. Proven knowledge of the software systems employed in backend manufacturing and analytics, including MAM, MES, JMP, Tableau, etc., is highly encouraged.

Education and Experience:

• A minimum of a BS degree or an equivalent qualification in Engineering (such as Electronics, Mechanical, Physics, Semiconductor, Materials) or a related field is required.
• Master’s degrees in physics, statistics, or Engineering (Semiconductor, Electronics, Mechanical, Materials) or equivalent experience.
• At least 10 years of working experience in PWF, DCA and 3DS packaging. Direct experience in HBM will be preferred.

Qualification and Skills:

• Knowledge in Micro Electronic Packaging, Product Integrity and Durability Engineering and Failure Analysis are preferred.
• Knowledge of materials properties, applications, and materials characterization.
• Experience in memory or related products in assembly, testing or reliability preferred.
• Experience in data analysis and reliability modelling is advantageous.
• Working level detail knowledge on memory with high data bandwidth and 3D coordinated packaging is desirable.
  
  AI Relevant Job Responsibilities:
  - Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  - Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
  - Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business