Sr. Manager, Package Design/Development Quality Assurance

Req. ID: JR95530 Sr. Manager, Package Design/Development Quality Assurance Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Package Design/Development Quality Assurance (DDQA) Senior Manager in Micron’s Global Quality (GQ) organization, you will lead a highly specialized engineering team responsible for enabling the successful introduction of Micron’s most advanced package technologies. This role is central to ensuring that chip‑package interaction risks, reliability concerns, and customer integration challenges are identified and mitigated early—before they impact product qualification, customer deployment, or field performance. You will work closely with Technology Development, Design, Assembly, and customer‑facing teams to drive deep technical understanding of package‑level failure mechanisms, define robust characterization and reliability strategies, and guide critical engineering trade‑offs. Beyond execution, this role offers the opportunity to shape next‑generation package technology by driving lessons learned into future designs, influencing industry practices, and publishing technical work that advances Micron’s leadership position. Success requires a leader who can combine technical authority, people leadership, and cross‑functional influence to deliver both near‑term results and long‑term technology impact. Responsibilities and Tasks Technical & DDQA Leadership * Lead DDQA strategy for new package technology introductions, with focus on CPI and customer integration risks * Drive early identification and mitigation of package‑level reliability and interaction risks * Define and oversee characterization and reliability test strategies * Guide development of fundamental understanding of package‑related failure mechanisms * Ensure effective root cause analysis and closure of package technology quality issues * Drive systematic capture and reuse of lessons learned in next‑generation technologies * Act as a technical escalation point for package‑related customer quality and integration issues People & Team Leadership * Lead, mentor, and develop a highly technical DDQA engineering team * Set clear expectations, performance goals, and development plans for direct reports * Build technical depth, engagement, and succession within the organization * Foster a culture of accountability, collaboration, and technical excellence Technology Advancement & Industry Impact * Drive internal and external technical publications related to package reliability and CPI * Mentor engineers in technical writing and thought leadership * Contribute innovative solutions that advance Micron’s package technology roadmap Operational Excellence & Governance * Own resource planning and drive efficiency improvements * Define and track DDQA performance metrics * Ensure compliance with training, safety, and ethical standards * Drive continuous improvement in processes, tools, and execution Experience 10+ years of experience in one or more of the following areas: • Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, and/or Failure Analysis Qualifications • Demonstrated ability to lead and develop senior technical engineers • Strong knowledge of semiconductor package assembly and surface‑mount processes • Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability • Working knowledge of industry reliability test methods, acceleration models, and sampling statistics • Experience applying FMEA and structured problem‑solving methodologies (e.g., 8D) • Strong analytical skills with the ability to translate complex data into clear technical decisions • Proven ability to collaborate across functions and influence outcomes in complex technical environments Job Profile(s): Quality Engineering Manager 2 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.