Job description
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer Job Qualifications 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.#LI-DNI TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X // Select all anchor elements that have a jobId in their href const anchors = document.querySelectorAll('.custom-links a[href*="jobId="]'); const URLSource = window.location.href.match(/source=([^&]+)/)[1]; const URLTags = window.location.href.match(/tags=([^&]+)/)[1]; // Loop through each matching anchor element anchors.forEach(anchor => { // Get the current href of the anchor const href = anchor.getAttribute('href'); // Extract the jobId using a regular expression const jobIdMatch = href.match(/jobId=(\d+)/); const hasCareersPath = href.match(/\/careers\//); if (jobIdMatch) { const jobId = jobIdMatch[1]; // Capture the jobId value // Construct the new href with the extracted jobId const newHrefStart = anchor.getAttribute("href").split("?")[0], newHref = newHrefStart + `?jobId=${jobId}&source=${URLSource}&tags=${URLTags}`; // Set the new href attribute anchor.setAttribute('href', newHref); } }); { "@context": "http://schema.org", "@type": "JobPosting", "datePosted": null, "description": "\u003Cdiv\u003E\u003Cp style=\"margin: 0in;\"\u003E\u003Cspan style=\"font-family: arial; font-size: small;\"\u003E\u767c\u63ee\u6240\u624d\u3001\u63a5\u529b\u672a\u4f86\uff0c\u003C\/span\u003E\u003Ca href=\"https:\/\/www.tsmc.com\/static\/chinese\/careers\/rd\/index.html\" target=\"_blank\" rel=\"noreferrer noopener\" style=\"font-family: arial; font-size: small;\"\u003E\u53f0\u7a4d\u96fb R&D\u003C\/a\u003E\u003Cspan style=\"font-family: arial; font-size: small;\"\u003E \u662f\u9ad8\u624b\u96f2\u96c6\u7684\u532f\u805a\u4e4b\u5730\uff0c\u003C\/span\u003E\u003C\/p\u003E\u003Cp style=\"margin: 0in;\"\u003E\u003Cfont face=\"arial\" size=\"2\"\u003E\u5728\u9019\u88e1\uff0c\u6bcf\u500b\u4eba\u90fd\u8eab\u61f7\u7d55\u6280\u3001\u64c1\u6709\u8d85\u51e1\u80fd\u529b\uff01\u003C\/font\u003E\u003C\/p\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EAdvanced Packaging\u7684\u4f7f\u547d\u662f\u63d0\u4f9b\u6700\u4f73\u7684\u7570\u8cea\u6574\u5408\u6280\u8853\uff0c\u5be6\u73fe\u7cfb\u7d71\u64f4\u5c55\u548c\u6027\u80fd\u63d0\u5347\uff0c\u6210\u70ba\u6700\u5177\u7af6\u722d\u529b\u7684\u5148\u9032\u5c01\u88dd\u89e3\u6c7a\u65b9\u6848\u63d0\u4f9b\u8005\uff0c\u8207\u5408\u4f5c\u5925\u4f34\u5171\u540c\u91cb\u653e\u5275\u65b0\u6f5b\u529b\u4e26\u5f71\u97ff\u7522\u696d\u751f\u614b\u7cfb\u7d71\u7684\u767c\u5c55\u3002\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EAdvanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.\u003C\/div\u003E", "employmentType": ["Regular"], "hiringOrganization" : { "@type": "Organization", "name": "TSMC - Taiwan Semiconductor Manufacturing Company Limited", "url": "https://careers.tsmc.com/en_US/careers", "logo": "https://careers.tsmc.com/_cms/6/image/logoHiringOrganization/1?version=269513", "sameAs": "https:\/\/www.tsmc.com\/english" }, "identifier": { "value": 6155, "@type": "PropertyValue" }, "jobLocation" : { "@type": "Place", "address": { "streetAddress": "Taiwan", "@type": "PostalAddress" } }, "educationRequirements": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "experienceRequirements": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "workHours": "\u003Cdiv\u003E2026 \u71b1\u9580\u8077\u7f3a\/2026 Popular Job Positions:\u003C\/div\u003E\u003Cblockquote style=\"padding: 0px; margin: 0px 0px 0px 40px; border-color: currentcolor; border-style: none; border-width: medium; border-image: initial;\"\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. \u003Ca href=\"https:\/\/careers.tsmc.com\/careers\/JobDetail?jobId=11865&source=External+Career+Site\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Module Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E2. \u003Ca href=\"https:\/\/careers.tsmc.com\/zh_TW\/careers\/JobDetail?jobId=16521\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Packaging Simulation Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E3. \u003Ca href=\"https:\/\/careers.tsmc.com\/en_US\/careers\/JobDetail?jobId=21826\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Integration Engineer\u003C\/a\u003E\u003C\/div\u003E\u003C\/blockquote\u003E", "qualifications": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "responsibilities": "\u003Cdiv\u003E2026 \u71b1\u9580\u8077\u7f3a\/2026 Popular Job Positions:\u003C\/div\u003E\u003Cblockquote style=\"padding: 0px; margin: 0px 0px 0px 40px; border-color: currentcolor; border-style: none; border-width: medium; border-image: initial;\"\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. \u003Ca href=\"https:\/\/careers.tsmc.com\/careers\/JobDetail?jobId=11865&source=External+Career+Site\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Module Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E2. \u003Ca href=\"https:\/\/careers.tsmc.com\/zh_TW\/careers\/JobDetail?jobId=16521\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Packaging Simulation Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E3. \u003Ca href=\"https:\/\/careers.tsmc.com\/en_US\/careers\/JobDetail?jobId=21826\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Integration Engineer\u003C\/a\u003E\u003C\/div\u003E\u003C\/blockquote\u003E", "skills": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "title" : "R&D\u5148\u9032\u5c01\u88dd\u6280\u8853\u767c\u5c55" }
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer Job Qualifications 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.#LI-DNI TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X // Select all anchor elements that have a jobId in their href const anchors = document.querySelectorAll('.custom-links a[href*="jobId="]'); const URLSource = window.location.href.match(/source=([^&]+)/)[1]; const URLTags = window.location.href.match(/tags=([^&]+)/)[1]; // Loop through each matching anchor element anchors.forEach(anchor => { // Get the current href of the anchor const href = anchor.getAttribute('href'); // Extract the jobId using a regular expression const jobIdMatch = href.match(/jobId=(\d+)/); const hasCareersPath = href.match(/\/careers\//); if (jobIdMatch) { const jobId = jobIdMatch[1]; // Capture the jobId value // Construct the new href with the extracted jobId const newHrefStart = anchor.getAttribute("href").split("?")[0], newHref = newHrefStart + `?jobId=${jobId}&source=${URLSource}&tags=${URLTags}`; // Set the new href attribute anchor.setAttribute('href', newHref); } }); { "@context": "http://schema.org", "@type": "JobPosting", "datePosted": null, "description": "\u003Cdiv\u003E\u003Cp style=\"margin: 0in;\"\u003E\u003Cspan style=\"font-family: arial; font-size: small;\"\u003E\u767c\u63ee\u6240\u624d\u3001\u63a5\u529b\u672a\u4f86\uff0c\u003C\/span\u003E\u003Ca href=\"https:\/\/www.tsmc.com\/static\/chinese\/careers\/rd\/index.html\" target=\"_blank\" rel=\"noreferrer noopener\" style=\"font-family: arial; font-size: small;\"\u003E\u53f0\u7a4d\u96fb R&D\u003C\/a\u003E\u003Cspan style=\"font-family: arial; font-size: small;\"\u003E \u662f\u9ad8\u624b\u96f2\u96c6\u7684\u532f\u805a\u4e4b\u5730\uff0c\u003C\/span\u003E\u003C\/p\u003E\u003Cp style=\"margin: 0in;\"\u003E\u003Cfont face=\"arial\" size=\"2\"\u003E\u5728\u9019\u88e1\uff0c\u6bcf\u500b\u4eba\u90fd\u8eab\u61f7\u7d55\u6280\u3001\u64c1\u6709\u8d85\u51e1\u80fd\u529b\uff01\u003C\/font\u003E\u003C\/p\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EAdvanced Packaging\u7684\u4f7f\u547d\u662f\u63d0\u4f9b\u6700\u4f73\u7684\u7570\u8cea\u6574\u5408\u6280\u8853\uff0c\u5be6\u73fe\u7cfb\u7d71\u64f4\u5c55\u548c\u6027\u80fd\u63d0\u5347\uff0c\u6210\u70ba\u6700\u5177\u7af6\u722d\u529b\u7684\u5148\u9032\u5c01\u88dd\u89e3\u6c7a\u65b9\u6848\u63d0\u4f9b\u8005\uff0c\u8207\u5408\u4f5c\u5925\u4f34\u5171\u540c\u91cb\u653e\u5275\u65b0\u6f5b\u529b\u4e26\u5f71\u97ff\u7522\u696d\u751f\u614b\u7cfb\u7d71\u7684\u767c\u5c55\u3002\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EAdvanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.\u003C\/div\u003E", "employmentType": ["Regular"], "hiringOrganization" : { "@type": "Organization", "name": "TSMC - Taiwan Semiconductor Manufacturing Company Limited", "url": "https://careers.tsmc.com/en_US/careers", "logo": "https://careers.tsmc.com/_cms/6/image/logoHiringOrganization/1?version=269513", "sameAs": "https:\/\/www.tsmc.com\/english" }, "identifier": { "value": 6155, "@type": "PropertyValue" }, "jobLocation" : { "@type": "Place", "address": { "streetAddress": "Taiwan", "@type": "PostalAddress" } }, "educationRequirements": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "experienceRequirements": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "workHours": "\u003Cdiv\u003E2026 \u71b1\u9580\u8077\u7f3a\/2026 Popular Job Positions:\u003C\/div\u003E\u003Cblockquote style=\"padding: 0px; margin: 0px 0px 0px 40px; border-color: currentcolor; border-style: none; border-width: medium; border-image: initial;\"\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. \u003Ca href=\"https:\/\/careers.tsmc.com\/careers\/JobDetail?jobId=11865&source=External+Career+Site\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Module Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E2. \u003Ca href=\"https:\/\/careers.tsmc.com\/zh_TW\/careers\/JobDetail?jobId=16521\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Packaging Simulation Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E3. \u003Ca href=\"https:\/\/careers.tsmc.com\/en_US\/careers\/JobDetail?jobId=21826\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Integration Engineer\u003C\/a\u003E\u003C\/div\u003E\u003C\/blockquote\u003E", "qualifications": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "responsibilities": "\u003Cdiv\u003E2026 \u71b1\u9580\u8077\u7f3a\/2026 Popular Job Positions:\u003C\/div\u003E\u003Cblockquote style=\"padding: 0px; margin: 0px 0px 0px 40px; border-color: currentcolor; border-style: none; border-width: medium; border-image: initial;\"\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. \u003Ca href=\"https:\/\/careers.tsmc.com\/careers\/JobDetail?jobId=11865&source=External+Career+Site\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Module Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E2. \u003Ca href=\"https:\/\/careers.tsmc.com\/zh_TW\/careers\/JobDetail?jobId=16521\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Packaging Simulation Engineer\u003C\/a\u003E\u003C\/div\u003E\u003Cdiv\u003E3. \u003Ca href=\"https:\/\/careers.tsmc.com\/en_US\/careers\/JobDetail?jobId=21826\" target=\"_blank\" rel=\"noreferrer noopener\"\u003ER&D Advanced Packaging Integration Engineer\u003C\/a\u003E\u003C\/div\u003E\u003C\/blockquote\u003E", "skills": "\u003Cdiv\u003E1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering\/science discipline. \u003C\/div\u003E\u003Cdiv\u003E2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. \u003C\/div\u003E\u003Cdiv\u003E3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cfont color=\"#ffffff\"\u003E#LI-DNI\u003C\/font\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cspan style=\"font-style: italic;\"\u003E\u003C\/span\u003E\u003C\/div\u003E", "title" : "R&D\u5148\u9032\u5c01\u88dd\u6280\u8853\u767c\u5c55" }
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer Job Qualifications 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.#LI-DNI TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer Job Qualifications 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.#LI-DNI TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer Job Qualifications 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.#LI-DNI TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer Job Qualifications 1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline. 2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development. 3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.#LI-DNI TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026
Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area R&D Advanced Packaging Technology Development Job Type Engineer / Admin Employment Type Regular Posted Jun 04, 2026
Company Taiwan Semiconductor Manufacturing Company Limited
Company
Taiwan Semiconductor Manufacturing Company Limited
Location Taiwan
Location
Taiwan
Career Area R&D Advanced Packaging Technology Development
Career Area
R&D Advanced Packaging Technology Development
Job Type Engineer / Admin
Job Type
Engineer / Admin
Employment Type Regular
Employment Type
Regular
Posted Jun 04, 2026
Posted
Jun 04, 2026
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，在這裡，每個人都身懷絕技、擁有超凡能力！
發揮所才、接力未來，台積電 R&D 是高手雲集的匯聚之地，
發揮所才、接力未來，
台積電 R&D
是高手雲集的匯聚之地，
在這裡，每個人都身懷絕技、擁有超凡能力！
Advanced Packaging的使命是提供最佳的異質整合技術，實現系統擴展和性能提升，成為最具競爭力的先進封裝解決方案提供者，與合作夥伴共同釋放創新潛力並影響產業生態系統的發展。
Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer
Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer
Job Responsibilities 2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer
Job Responsibilities
2026 熱門職缺/2026 Popular Job Positions:1. R&D Advanced Packaging Module Engineer2. R&D Packaging Simulation Engineer3. R&D Advanced Packaging Integration Engineer
2026 熱門職缺/2026 Popular Job Positions:
1. R&D Advanced Packaging Module Engineer
R&D Advanced Packaging Module Engineer