Process Engineer – Die to Wafer Hybrid Bonding

Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters, where you will work with a cross-functional research team to develop cutting-edge 2.5D/3D advanced packaging technologies. We are seeking hands on Process Engineers to drive die to wafer (D2W) hybrid bonding R&D. This role focuses on hybrid bonding process development, pathfinding, technology de risking, and advanced packaging integration exploration. The role provides on the job training and hands on experience with state of the art equipment, including the industry’s first fully integrated die to wafer hybrid bonding system. Key Responsibilities • Develop die to wafer hybrid bonding processes, including (but not limited to): * Surface preparation and plasma activation * High accuracy die placement and alignment * Post bond characterization and process evaluation • Integrate D2W bonding with adjacent process modules such as: * Dicing and die preparation * Die thinning * Inter die gap fill and planarization • Design and execute DOE driven experiments to understand process limits, sensitivities, and trade offs. • Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement. Qualifications • Ph.D. or M. S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline. • In depth knowledge and hands on experience in one or more of the following: * Die to wafer or wafer to wafer hybrid bonding * Thin die handling and alignment critical processes * Micro-LED or CPO experience * Heterogeneous integration such as III-V to Si, novel materials to Si 2.5D/3D integration * Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.) • Strong understanding of: * Bond interface physics * Alignment and overlay fundamentals * Mechanical behavior of thin and fragile dies • Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP). • Self starter with strong problem solving skills; able to work both independently and collaboratively with minimal supervision. • Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams. ## Qualifications ### Education: Bachelor's Degree ### Skills 3D Integration (Inactive), Wafer Bonding Systems ### Certifications: ### Languages: ### Years of Experience: 7 - 10 Years ### Work Experience: ## Additional Information ### ### Shift: 10-Day 8-Hr (United States of America) ### ### Travel: Yes, 10% of the Time ### ### Relocation Eligible: Yes ### Referral Payment Plan: None Salary Range: $147,000.00 - $202,500.00 The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.