Job description
Req. ID: JR106718 Principal/Staff Advanced Packaging Development Process Engineer Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal \- Staff Advanced Packaging Development Process Engineer Role Summary: The Advanced Packaging Development Process Engineer will develop and qualify wafer singulation technologies for next-generation HBM and advanced packaging products. This position will lead dicing, thinning, and die separation process development, working closely with cross-functional teams, equipment suppliers, and material partners to enable future packaging technologies and manufacturing readiness. Main Responsibilities: * Develop and optimize advanced wafer singulation technologies, including blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, and die separation. * Support wafer thinning, grinding, mounting, and handling processes for advanced packaging applications. * Design and execute DOE plans to improve yield, quality, and process capability. * Evaluate and qualify new dicing equipment, tooling, and materials. * Conduct process characterization, defect analysis, and root-cause investigations using statistical methods. * Drive yield improvement and process troubleshooting using structured problem-solving methodologies (KT, 5-Why, 8D). * Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable technology development and transfer to production. * Monitor process health using SPC, FDC, JMP, and data analytics tools. * Partner with external suppliers to co-develop equipment and materials for future technology nodes. AI Responsibilities: * Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. * Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Candidate Profile Minimum Required Qualifications: * PhD with ≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field. * Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing. Must Have Technical Skills: * Hands-on experience in wafer dicing, die separation, wafer thinning/grinding, or advanced packaging technologies. * Strong knowledge of DOE, SPC, JMP, and data analysis. * Proven problem-solving skills and experience in process optimization. * Strong communication skills and ability to work effectively in cross-functional global teams. Must Have Soft Skills: * Strong analytical and problem-solving capabilities. * Outstanding communication, leadership, and stakeholder management skills. * Ability to work independently and collaboratively in a fast-paced environment. * Ability to work cross-functionally with process, equipment, and reliability teams. AI Requirements: * Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes. Embody Micron’s core values: * People – Respect, develop, and empower others * Innovation – Drive continuous improvement and breakthrough thinking * Tenacity – Show grit and determination * Collaboration – Build trust and foster teamwork * Customer Focus – Deliver excellence and value * Speed – Act with purpose and set the pace Job Profile(s): Product Development Engineer 5 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.