Job description
Req. ID: JR102733 Principal Engineer, FE OCT CPEE ADT BOND Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding). You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites. ## Key Responsibilities ### Process Development & Optimization * Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration) * Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets * Drive process capability improvement (Cpk) and defect reduction ### Yield & Reliability Improvement * Lead yield enhancement initiatives by analyzing process, tool, and material interactions * Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques * Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions ### Equipment & Materials Engineering * Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms) * Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements * Evaluate and introduce new materials/spares/parts for performance improvement ### Technology Transfer & Process Integration * Support technology transfer and ramp-up across global sites * Align process baseline (POR) and ensure consistency through documentation and control plans * Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility ### Manufacturing Support & Problem Solving * Diagnose and resolve manufacturing line issues impacting bonding yield and performance * Analyze process excursions and implement containment and recovery actions * Drive continuous improvement for cycle time, tool availability, and cost efficiency ### Qualification & Control * Lead new process and baseline qualifications * Develop control plans, SPC strategies, and inline monitoring systems * Establish risk mitigation frameworks and ensure compliance with manufacturing standards ### Supplier & Cross-Functional Collaboration * Partner with suppliers for technology development, process improvement, and cost optimization * Audit material and equipment suppliers to ensure quality and reliability targets are met * Collaborate with global teams and partners to drive alignment and execution AI Responsibilities: • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. ## ## Requirements: * Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field * 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging * Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred) * Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms * Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred * Proficiency in data analysis, SPC, and statistical modeling * Strong problem-solving skills using structured methodologies (8D, FMEA, DOE) * Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment * Excellent communication and collaboration skills across global teams * 12-inch wafer-to-wafer bonding (from TEL or EVG tool is preferred) and/or 12-inch wafer backside grinding (from Disco tool is preferred) Job Profile(s): FAB Engineer 5 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.