PCBA Manufacturing Engineer

Active

Job description

Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. <\/p>\n

<\/p>\n

Role Summary:<\/p>\n

You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. <\/p>\n

<\/p>\n

Key Responsibilities:<\/p>\n

Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.<\/li>\n
Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.<\/li>\n
Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.<\/li>\n
Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.<\/li>\n
Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.<\/li>\n
Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.<\/li>\n
Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.<\/li>\n
Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.<\/li>\n
Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.<\/li>\n
Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.<\/li>\n
Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.<\/li>\n
Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.<\/li>\n<\/ul>\n

<\/p>\n
Required Qualifications:<\/p>\n
- BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field.<\/li>\n
- 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred.<\/li>\n
- Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps.<\/li>\n
- Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability.<\/li>\n
- Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action.<\/li>\n
- Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX.<\/li>\n
- Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations.<\/li>\n
- Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools.<\/li>\n
- Strong cross-functional communication, ownership, prioritization, and problem-solving skills.<\/li>\n
- Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations.<\/li>\n
- Experience working at a high-volume CM for PCBA and box-build products.<\/li>\n
- Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.<\/li>\n<\/ul>","identifier":{"@type":"PropertyValue","name":"Nexthop Systems Inc","value":"102"},"datePosted":"2026-08-06","employmentType":"OTHER","hiringOrganization":{"@type":"Organization","name":"Nexthop Systems Inc","logo":"https://images7.bamboohr.com/652331/logos/cropped.jpg?v=37"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Vietnam, Bac Ninh","addressRegion":"Industrial Park","postalCode":"220000","addressCountry":"Viet Nam"}},"url":"https://nexthopai.bamboohr.com/careers/102"}Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms. Apply for This JobLink to This JobLocationVietnam, Bac Ninh, Industrial ParkDepartment7040 - Supply Chain APACEmployment TypeFull-TimeMinimum ExperienceExperiencedPrivacy Policy • Terms of Service • © BambooHR All rights reserved.
  Privacy Policy{"@context":"http://schema.org","@type":"JobPosting","title":"PCBA Manufacturing Engineer","description":"
  Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. <\/p>\n
  
  <\/p>\n
  Role Summary:<\/p>\n
  You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. <\/p>\n
  
  <\/p>\n
  Key Responsibilities:<\/p>\n
  - Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.<\/li>\n
  - Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.<\/li>\n
  - Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.<\/li>\n
  - Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.<\/li>\n
  - Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.<\/li>\n
  - Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.<\/li>\n
  - Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.<\/li>\n
  - Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.<\/li>\n
  - Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.<\/li>\n
  - Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.<\/li>\n
  - Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.<\/li>\n
  - Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.<\/li>\n<\/ul>\n
    
    <\/p>\n
    Required Qualifications:<\/p>\n
    - BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field.<\/li>\n
    - 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred.<\/li>\n
    - Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps.<\/li>\n
    - Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability.<\/li>\n
    - Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action.<\/li>\n
    - Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX.<\/li>\n
    - Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations.<\/li>\n
    - Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools.<\/li>\n
    - Strong cross-functional communication, ownership, prioritization, and problem-solving skills.<\/li>\n
    - Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations.<\/li>\n
    - Experience working at a high-volume CM for PCBA and box-build products.<\/li>\n
    - Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.<\/li>\n<\/ul>","identifier":{"@type":"PropertyValue","name":"Nexthop Systems Inc","value":"102"},"datePosted":"2026-08-06","employmentType":"OTHER","hiringOrganization":{"@type":"Organization","name":"Nexthop Systems Inc","logo":"https://images7.bamboohr.com/652331/logos/cropped.jpg?v=37"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Vietnam, Bac Ninh","addressRegion":"Industrial Park","postalCode":"220000","addressCountry":"Viet Nam"}},"url":"https://nexthopai.bamboohr.com/careers/102"}Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms. Apply for This JobLink to This JobLocationVietnam, Bac Ninh, Industrial ParkDepartment7040 - Supply Chain APACEmployment TypeFull-TimeMinimum ExperienceExperiencedPrivacy Policy • Terms of Service • © BambooHR All rights reserved.
      Privacy Policy{"@context":"http://schema.org","@type":"JobPosting","title":"PCBA Manufacturing Engineer","description":"
      Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. <\/p>\n
      
      <\/p>\n
      Role Summary:<\/p>\n
      You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. <\/p>\n
      
      <\/p>\n
      Key Responsibilities:<\/p>\n
      - Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.<\/li>\n
      - Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.<\/li>\n
      - Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.<\/li>\n
      - Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.<\/li>\n
      - Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.<\/li>\n
      - Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.<\/li>\n
      - Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.<\/li>\n
      - Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.<\/li>\n
      - Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.<\/li>\n
      - Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.<\/li>\n
      - Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.<\/li>\n
      - Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.<\/li>\n<\/ul>\n
        
        <\/p>\n
        Required Qualifications:<\/p>\n
        \n
        BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field.<\/li>\n
        10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred.<\/li>\n
        Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps.<\/li>\n
        Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability.<\/li>\n
        Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action.<\/li>\n
        Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX.<\/li>\n
        Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations.<\/li>\n
        Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools.<\/li>\n
        Strong cross-functional communication, ownership, prioritization, and problem-solving skills.<\/li>\n
        Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations.<\/li>\n
        Experience working at a high-volume CM for PCBA and box-build products.<\/li>\n
        Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.<\/li>\n<\/ul>","identifier":{"@type":"PropertyValue","name":"Nexthop Systems Inc","value":"102"},"datePosted":"2026-08-06","employmentType":"OTHER","hiringOrganization":{"@type":"Organization","name":"Nexthop Systems Inc","logo":"https://images7.bamboohr.com/652331/logos/cropped.jpg?v=37"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Vietnam, Bac Ninh","addressRegion":"Industrial Park","postalCode":"220000","addressCountry":"Viet Nam"}},"url":"https://nexthopai.bamboohr.com/careers/102"}Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms. Apply for This JobLink to This JobLocationVietnam, Bac Ninh, Industrial ParkDepartment7040 - Supply Chain APACEmployment TypeFull-TimeMinimum ExperienceExperiencedPrivacy Policy • Terms of Service • © BambooHR All rights reserved.
        Privacy Policy{"@context":"http://schema.org","@type":"JobPosting","title":"PCBA Manufacturing Engineer","description":"
        Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. <\/p>\n
        
        <\/p>\n
        Role Summary:<\/p>\n
        You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. <\/p>\n
        
        <\/p>\n
        Key Responsibilities:<\/p>\n
        \n
        Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.<\/li>\n
        Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.<\/li>\n
        Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.<\/li>\n
        Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.<\/li>\n
        Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.<\/li>\n
        Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.<\/li>\n
        Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.<\/li>\n
        Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.<\/li>\n
        Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.<\/li>\n
        Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.<\/li>\n
        Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.<\/li>\n
        Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.<\/li>\n<\/ul>\n
        
        <\/p>\n
        Required Qualifications:<\/p>\n
        \n
        BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field.<\/li>\n
        10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred.<\/li>\n
        Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps.<\/li>\n
        Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability.<\/li>\n
        Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action.<\/li>\n
        Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX.<\/li>\n
        Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations.<\/li>\n
        Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools.<\/li>\n
        Strong cross-functional communication, ownership, prioritization, and problem-solving skills.<\/li>\n
        Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations.<\/li>\n
        Experience working at a high-volume CM for PCBA and box-build products.<\/li>\n
        Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.<\/li>\n<\/ul>","identifier":{"@type":"PropertyValue","name":"Nexthop Systems Inc","value":"102"},"datePosted":"2026-08-06","employmentType":"OTHER","hiringOrganization":{"@type":"Organization","name":"Nexthop Systems Inc","logo":"https://images7.bamboohr.com/652331/logos/cropped.jpg?v=37"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Vietnam, Bac Ninh","addressRegion":"Industrial Park","postalCode":"220000","addressCountry":"Viet Nam"}},"url":"https://nexthopai.bamboohr.com/careers/102"}Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms. Apply for This JobLink to This JobLocationVietnam, Bac Ninh, Industrial ParkDepartment7040 - Supply Chain APACEmployment TypeFull-TimeMinimum ExperienceExperiencedPrivacy Policy • Terms of Service • © BambooHR All rights reserved.
        Privacy Policy{"@context":"http://schema.org","@type":"JobPosting","title":"PCBA Manufacturing Engineer","description":"
        Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. <\/p>\n
        
        <\/p>\n
        Role Summary:<\/p>\n
        You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. <\/p>\n
        
        <\/p>\n
        Key Responsibilities:<\/p>\n
        \n
        Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.<\/li>\n
        Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.<\/li>\n
        Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.<\/li>\n
        Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.<\/li>\n
        Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.<\/li>\n
        Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.<\/li>\n
        Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.<\/li>\n
        Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.<\/li>\n
        Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.<\/li>\n
        Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.<\/li>\n
        Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.<\/li>\n
        Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.<\/li>\n<\/ul>\n
        
        <\/p>\n
        Required Qualifications:<\/p>\n
        \n
        BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field.<\/li>\n
        10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred.<\/li>\n
        Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps.<\/li>\n
        Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability.<\/li>\n
        Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action.<\/li>\n
        Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX.<\/li>\n
        Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations.<\/li>\n
        Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools.<\/li>\n
        Strong cross-functional communication, ownership, prioritization, and problem-solving skills.<\/li>\n
        Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations.<\/li>\n
        Experience working at a high-volume CM for PCBA and box-build products.<\/li>\n
        Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.<\/li>\n<\/ul>","identifier":{"@type":"PropertyValue","name":"Nexthop Systems Inc","value":"102"},"datePosted":"2026-08-06","employmentType":"OTHER","hiringOrganization":{"@type":"Organization","name":"Nexthop Systems Inc","logo":"https://images7.bamboohr.com/652331/logos/cropped.jpg?v=37"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Vietnam, Bac Ninh","addressRegion":"Industrial Park","postalCode":"220000","addressCountry":"Viet Nam"}},"url":"https://nexthopai.bamboohr.com/careers/102"}Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms. Apply for This JobLink to This JobLocationVietnam, Bac Ninh, Industrial ParkDepartment7040 - Supply Chain APACEmployment TypeFull-TimeMinimum ExperienceExperienced
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        Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms. Apply for This JobLink to This JobLocationVietnam, Bac Ninh, Industrial ParkDepartment7040 - Supply Chain APACEmployment TypeFull-TimeMinimum ExperienceExperienced
        Job OpeningsPCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial ParkNexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.
        Job Openings
        Job Openings
        Job Openings
        PCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial Park
        PCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial Park
        PCBA Manufacturing Engineer7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial Park
        PCBA Manufacturing Engineer
        7040 - Supply Chain APAC - Vietnam, Bac Ninh, Industrial Park
        Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.
        Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.
        Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers. Role Summary: You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing. Key Responsibilities: Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs. Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards. Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings. Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities. Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm. Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods. Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions. Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging. Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems. Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX. Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management. Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution. Required Qualifications: BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field. 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred. Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps. Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability. Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action. Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX. Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations. Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools. Strong cross-functional communication, ownership, prioritization, and problem-solving skills. Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations. Experience working at a high-volume CM for PCBA and box-build products. Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.
        Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers.
        Role Summary:
        You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing.
        Key Responsibilities:
        Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.
        Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.
        Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.
        Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.
        Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.
        Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.
        Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.
        Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.
        Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.
        Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.
        Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.
        Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.