Packaging Engineer

Drive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression)Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle timeEstablish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modulesApply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performanceRequirementsBachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of studyMinimum 5 years-experience in the semiconductor fieldExpert level experience in process development for power stage, multi chip module.Package layer design expertise such as structural configuration, material selection and process flow designHands on skills in operating machines and knowledge to down-select material, process optimization and yield improvementExpert experience of using ANSYS / FEA for stress modeling.Benefits- Competive Salary- Career Growth PlansDrive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression)Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle timeEstablish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modulesApply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance

• Drive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression)

Drive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression)

• Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle time

Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle time

• Establish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modules

Establish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modules

• Apply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance

Apply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance