Package Silicon Technology Node Development Director/DMTS

Req. ID: JR93610 Package Silicon Technology Node Development Director/DMTS Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Director / DMTS – Package Development Engineering (PDE) Role Overview Micron Technology is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as a Director / Distinguished Member of Technical Staff (DMTS). In this role, you will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next-generation memory products. You will operate at the intersection of silicon, package, and system-level integration, ensuring robust technology readiness and risk mitigation across increasingly complex design and process landscapes. This is a high-impact, cross-functional leadership role, requiring close collaboration with global engineering teams spanning Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality. You will play a critical role in shaping future memory product success through technology innovation, risk management, and execution excellence. Key Responsibilities Technical Leadership & Strategy • Define, develop, and maintain long-term chip-package interaction (CPI) technology roadmaps aligned with advanced silicon node transitions •Drive technology strategy and risk management frameworks to support future memory product launches • Lead global technical initiatives to ensure alignment between silicon, package, and test vehicle readiness Cross-Functional Collaboration • Partner closely with teams in: Fab Process Integration , Product Design & Development, Package Design & Assembly Technology Development, Global Quality & Reliability Engineering • Establish and drive CPI risk identification, modeling, and mitigation strategies across development cycles • Ensure seamless integration of design, process, and packaging requirements across multiple business units and geographies Execution & Alignment • Align priorities, timelines, and resource planning with senior leadership and key stakeholders • Drive execution rigor across programs, ensuring technology readiness and delivery milestones are met • Influence decision-making through data-driven insights and technical expertise Thought Leadership • Serve as a subject matter expert in CPI failure mechanisms and reliability risks • Mentor and guide engineering teams, fostering a culture of technical excellence and innovation • Represent PDE in strategic discussions with internal and external stakeholders Requirements : • Master’s or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related technical discipline • 15+ years of experience in semiconductor technology development, packaging, or related fields • Extensive experience in: Chip-package interaction and integration challenges, Electrical and physical failure mechanisms, Reliability testing, qualification, and screening methodologies • Strong track record of technical innovation and impact, evidenced by: Publications, Patent, Industry contributions • Deep understanding of semiconductor process technology development, including business processes and strategic planning • Strong knowledge of memory technologies and semiconductor device physics (preferred) • Demonstrated expertise in: Chip-package interaction (CPI) failure mechanisms, Reliability physics and risk assessment methodologies, Failure analysis, qualification, and screening techniques • Proven ability to lead complex, cross-disciplinary programs across global organizations • Strong collaboration and stakeholder management skills in a matrixed environment • Proven experience in technical leadership, mentoring, and driving organizational impact • Ability to manage multiple high-impact initiatives simultaneously • Excellent communication and presentation skills, with the ability to influence both technical and executive audiences Job Profile(s): Product Development DMTS Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.