ICSD _Server Platform/Mechanical/Thermal/BMC/BIOS Architect

TSMCLocation Taiwan

ActiveVerified 7h ago

Job description

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area Information Technology Job Type Engineer / Admin Employment Type Regular Posted Mar 20, 2026 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC IT is seeking skilled and experienced Server Platform, Mechanical, Thermal, or BMC/BIOS Architect to plan and manage the platform, mechanical, thermal, BMC, and BIOS aspects of servers. The candidate must be experienced in the server industry. Job Responsibilities Your responsibilities include:Candidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC/BIOS Firmware Architect.【Server Platform architect】1. Familiar with server CPU/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design.2. Experienced in server motherboard (MB), backplanes, and adapter boards design.3. Familiar with storage components' features and operations.4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards.5. Capable of debugging server hardware issues.6. Communicate effectively with server vendors and provide guidance on platform design.7. Study new platform technology, including all IT equipment.【Server Mechanical and Thermal architect】1. Experienced in server thermal design and familiar with fan systems, heat sinks, and liquid cooling solutions.2. Expert in rack and data center cooling solution design.3. Familiar with all kinds of server system placements and chassis feature understanding.4. Familiar with OCP rack and thermal solutions.5. Capable of 3D modeling using tools such as Creo or SolidWorks.6. Capable of thermal simulations.7. Understand chassis and rack structure analysis.【BMC/BIOS firmware architect】1. Work with server vendors for BMC and BIOS coding and specification definitions.2. Familiar with OpenBMC.3. Modify BMC and provide TSMC proprietary RESTful APIs based on user requests.4. Work with storage software developers to define BMC's special roles in storage appliances.5. Communicate effectively with server vendors and provide guidance on BIOS/BMC design.Additional information for the job:Job Location: Hsinchu SiteThe complete interview process includes (●-Must-be assessment; ○-Optional assessment):●Manager interview, ○ HackerRank test, ●On-site personality and English test (which could be substituted with the result of an official English proficiency test), ●HR interview, ○Second manager interview, ● Technical review. Job Qualifications Job Requirements:1. A master's or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Computer Science, Information Technology, or related fields.2. Over 12 years of experience in server design, with demonstrated expertise across hardware, software, firmware, mechanical, and thermal integration.3. Strong knowledge of system architecture, thermal dynamics, firmware development, and mechanical design methodologies.4. Familiar with computing, storage and networking.5. Knowledge or experience in data center architecture.6. Good communication and interpersonal skills with proactive problem-solving capability.7. Strong analytical, problem solving, and organizational skills.Personal Attributes:1. Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements.2. Collaborative and a strong team player embracing cross-functional communication. TSMC Core Values At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term. (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers. Back to job list Apply Share Email Facebook LinkedIn X // Select all anchor elements that have a jobId in their href const anchors = document.querySelectorAll('.custom-links a[href*="jobId="]'); const URLSource = window.location.href.match(/source=([^&]+)/)[1]; const URLTags = window.location.href.match(/tags=([^&]+)/)[1]; // Loop through each matching anchor element anchors.forEach(anchor => { // Get the current href of the anchor const href = anchor.getAttribute('href'); // Extract the jobId using a regular expression const jobIdMatch = href.match(/jobId=(\d+)/); const hasCareersPath = href.match(/\/careers\//); if (jobIdMatch) { const jobId = jobIdMatch[1]; // Capture the jobId value // Construct the new href with the extracted jobId const newHrefStart = anchor.getAttribute("href").split("?")[0], newHref = newHrefStart + `?jobId=${jobId}&source=${URLSource}&tags=${URLTags}`; // Set the new href attribute anchor.setAttribute('href', newHref); } }); { "@context": "http://schema.org", "@type": "JobPosting", "datePosted": null, "description": "\u003Cdiv\u003ETSMC IT is seeking skilled and experienced Server Platform, Mechanical, Thermal, or BMC\/BIOS Architect to plan and manage the platform, mechanical, thermal, BMC, and BIOS aspects of servers. The candidate must be experienced in the server industry.\u003C\/div\u003E", "employmentType": ["Regular"], "hiringOrganization" : { "@type": "Organization", "name": "TSMC - Taiwan Semiconductor Manufacturing Company Limited", "url": "https://careers.tsmc.com/en_US/careers", "logo": "https://careers.tsmc.com/_cms/6/image/logoHiringOrganization/1?version=269513", "sameAs": "https:\/\/www.tsmc.com\/english" }, "identifier": { "value": 16605, "@type": "PropertyValue" }, "jobLocation" : { "@type": "Place", "address": { "streetAddress": "Taiwan", "@type": "PostalAddress" } }, "educationRequirements": "\u003Cdiv\u003EJob Requirements:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. A master's or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Computer Science, Information Technology, or related fields.\u003C\/div\u003E\u003Cdiv\u003E2. Over 12 years of experience in server design, with demonstrated expertise across hardware, software, firmware, mechanical, and thermal integration.\u003C\/div\u003E\u003Cdiv\u003E3. Strong knowledge of system architecture, thermal dynamics, firmware development, and mechanical design methodologies.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with computing, storage and networking.\u003C\/div\u003E\u003Cdiv\u003E5. Knowledge or experience in data center architecture.\u003C\/div\u003E\u003Cdiv\u003E6. Good communication and interpersonal skills with proactive problem-solving capability.\u003C\/div\u003E\u003Cdiv\u003E7. Strong analytical, problem solving, and organizational skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EPersonal Attributes:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements.\u003C\/div\u003E\u003Cdiv\u003E2. Collaborative and a strong team player embracing cross-functional communication.\u003C\/div\u003E", "experienceRequirements": "\u003Cdiv\u003EJob Requirements:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. A master's or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Computer Science, Information Technology, or related fields.\u003C\/div\u003E\u003Cdiv\u003E2. Over 12 years of experience in server design, with demonstrated expertise across hardware, software, firmware, mechanical, and thermal integration.\u003C\/div\u003E\u003Cdiv\u003E3. Strong knowledge of system architecture, thermal dynamics, firmware development, and mechanical design methodologies.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with computing, storage and networking.\u003C\/div\u003E\u003Cdiv\u003E5. Knowledge or experience in data center architecture.\u003C\/div\u003E\u003Cdiv\u003E6. Good communication and interpersonal skills with proactive problem-solving capability.\u003C\/div\u003E\u003Cdiv\u003E7. Strong analytical, problem solving, and organizational skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EPersonal Attributes:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements.\u003C\/div\u003E\u003Cdiv\u003E2. Collaborative and a strong team player embracing cross-functional communication.\u003C\/div\u003E", "workHours": "\u003Cdiv\u003EYour responsibilities include:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003ECandidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC\/BIOS Firmware Architect.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u3010Server Platform architect\u3011\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Familiar with server CPU\/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design.\u003C\/div\u003E\u003Cdiv\u003E2. Experienced in server motherboard (MB), backplanes, and adapter boards design.\u003C\/div\u003E\u003Cdiv\u003E3. Familiar with storage components' features and operations.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards.\u003C\/div\u003E\u003Cdiv\u003E5. Capable of debugging server hardware issues.\u003C\/div\u003E\u003Cdiv\u003E6. Communicate effectively with server vendors and provide guidance on platform design.\u003C\/div\u003E\u003Cdiv\u003E7. Study new platform technology, including all IT equipment.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u3010Server Mechanical and Thermal architect\u3011\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Experienced in server thermal design and familiar with fan systems, heat sinks, and liquid cooling solutions.\u003C\/div\u003E\u003Cdiv\u003E2. Expert in rack and data center cooling solution design.\u003C\/div\u003E\u003Cdiv\u003E3. Familiar with all kinds of server system placements and chassis feature understanding.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with OCP rack and thermal solutions.\u003C\/div\u003E\u003Cdiv\u003E5. Capable of 3D modeling using tools such as Creo or SolidWorks.\u003C\/div\u003E\u003Cdiv\u003E6. Capable of thermal simulations.\u003C\/div\u003E\u003Cdiv\u003E7. Understand chassis and rack structure analysis.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u3010BMC\/BIOS firmware architect\u3011\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Work with server vendors for BMC and BIOS coding and specification definitions.\u003C\/div\u003E\u003Cdiv\u003E2. Familiar with OpenBMC.\u003C\/div\u003E\u003Cdiv\u003E3. Modify BMC and provide TSMC proprietary RESTful APIs based on user requests.\u003C\/div\u003E\u003Cdiv\u003E4. Work with storage software developers to define BMC's special roles in storage appliances.\u003C\/div\u003E\u003Cdiv\u003E5. Communicate effectively with server vendors and provide guidance on BIOS\/BMC design.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EAdditional information for the job:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EJob Location: Hsinchu Site\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EThe complete interview process includes (\u25cf-Must-be assessment; \u25cb-Optional assessment):\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u25cfManager interview, \u25cb HackerRank test, \u25cfOn-site personality and English test (which could be substituted with the result of an official English proficiency test), \u25cfHR interview, \u25cbSecond manager interview, \u25cf Technical review.\u003C\/div\u003E", "qualifications": "\u003Cdiv\u003EJob Requirements:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. A master's or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Computer Science, Information Technology, or related fields.\u003C\/div\u003E\u003Cdiv\u003E2. Over 12 years of experience in server design, with demonstrated expertise across hardware, software, firmware, mechanical, and thermal integration.\u003C\/div\u003E\u003Cdiv\u003E3. Strong knowledge of system architecture, thermal dynamics, firmware development, and mechanical design methodologies.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with computing, storage and networking.\u003C\/div\u003E\u003Cdiv\u003E5. Knowledge or experience in data center architecture.\u003C\/div\u003E\u003Cdiv\u003E6. Good communication and interpersonal skills with proactive problem-solving capability.\u003C\/div\u003E\u003Cdiv\u003E7. Strong analytical, problem solving, and organizational skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EPersonal Attributes:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements.\u003C\/div\u003E\u003Cdiv\u003E2. Collaborative and a strong team player embracing cross-functional communication.\u003C\/div\u003E", "responsibilities": "\u003Cdiv\u003EYour responsibilities include:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003ECandidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC\/BIOS Firmware Architect.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u3010Server Platform architect\u3011\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Familiar with server CPU\/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design.\u003C\/div\u003E\u003Cdiv\u003E2. Experienced in server motherboard (MB), backplanes, and adapter boards design.\u003C\/div\u003E\u003Cdiv\u003E3. Familiar with storage components' features and operations.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards.\u003C\/div\u003E\u003Cdiv\u003E5. Capable of debugging server hardware issues.\u003C\/div\u003E\u003Cdiv\u003E6. Communicate effectively with server vendors and provide guidance on platform design.\u003C\/div\u003E\u003Cdiv\u003E7. Study new platform technology, including all IT equipment.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u3010Server Mechanical and Thermal architect\u3011\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Experienced in server thermal design and familiar with fan systems, heat sinks, and liquid cooling solutions.\u003C\/div\u003E\u003Cdiv\u003E2. Expert in rack and data center cooling solution design.\u003C\/div\u003E\u003Cdiv\u003E3. Familiar with all kinds of server system placements and chassis feature understanding.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with OCP rack and thermal solutions.\u003C\/div\u003E\u003Cdiv\u003E5. Capable of 3D modeling using tools such as Creo or SolidWorks.\u003C\/div\u003E\u003Cdiv\u003E6. Capable of thermal simulations.\u003C\/div\u003E\u003Cdiv\u003E7. Understand chassis and rack structure analysis.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u3010BMC\/BIOS firmware architect\u3011\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Work with server vendors for BMC and BIOS coding and specification definitions.\u003C\/div\u003E\u003Cdiv\u003E2. Familiar with OpenBMC.\u003C\/div\u003E\u003Cdiv\u003E3. Modify BMC and provide TSMC proprietary RESTful APIs based on user requests.\u003C\/div\u003E\u003Cdiv\u003E4. Work with storage software developers to define BMC's special roles in storage appliances.\u003C\/div\u003E\u003Cdiv\u003E5. Communicate effectively with server vendors and provide guidance on BIOS\/BMC design.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EAdditional information for the job:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EJob Location: Hsinchu Site\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EThe complete interview process includes (\u25cf-Must-be assessment; \u25cb-Optional assessment):\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E\u25cfManager interview, \u25cb HackerRank test, \u25cfOn-site personality and English test (which could be substituted with the result of an official English proficiency test), \u25cfHR interview, \u25cbSecond manager interview, \u25cf Technical review.\u003C\/div\u003E", "skills": "\u003Cdiv\u003EJob Requirements:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. A master's or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Computer Science, Information Technology, or related fields.\u003C\/div\u003E\u003Cdiv\u003E2. Over 12 years of experience in server design, with demonstrated expertise across hardware, software, firmware, mechanical, and thermal integration.\u003C\/div\u003E\u003Cdiv\u003E3. Strong knowledge of system architecture, thermal dynamics, firmware development, and mechanical design methodologies.\u003C\/div\u003E\u003Cdiv\u003E4. Familiar with computing, storage and networking.\u003C\/div\u003E\u003Cdiv\u003E5. Knowledge or experience in data center architecture.\u003C\/div\u003E\u003Cdiv\u003E6. Good communication and interpersonal skills with proactive problem-solving capability.\u003C\/div\u003E\u003Cdiv\u003E7. Strong analytical, problem solving, and organizational skills.\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003EPersonal Attributes:\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003C\/div\u003E\u003Cdiv\u003E1. Strong motivation and self-management capabilities and demonstrated ability to recommend and implement new IT technologies for operational improvements.\u003C\/div\u003E\u003Cdiv\u003E2. Collaborative and a strong team player embracing cross-functional communication.\u003C\/div\u003E", "title" : "ICSD _Server Platform\/Mechanical\/Thermal\/BMC\/BIOS Architect" }

Company Taiwan Semiconductor Manufacturing Company Limited Location Taiwan Career Area Information Technology Job Type Engineer / Admin Employment Type Regular Posted Mar 20, 2026

Company Taiwan Semiconductor Manufacturing Company Limited

Company

Taiwan Semiconductor Manufacturing Company Limited

Location Taiwan

Location

Taiwan

Career Area Information Technology

Career Area

Information Technology

Job Type Engineer / Admin

Job Type

Engineer / Admin

Employment Type Regular

Employment Type

Regular

Posted Mar 20, 2026

Posted

Mar 20, 2026

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

TSMC IT is seeking skilled and experienced Server Platform, Mechanical, Thermal, or BMC/BIOS Architect to plan and manage the platform, mechanical, thermal, BMC, and BIOS aspects of servers. The candidate must be experienced in the server industry.

Job Responsibilities Your responsibilities include:Candidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC/BIOS Firmware Architect.【Server Platform architect】1. Familiar with server CPU/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design.2. Experienced in server motherboard (MB), backplanes, and adapter boards design.3. Familiar with storage components' features and operations.4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards.5. Capable of debugging server hardware issues.6. Communicate effectively with server vendors and provide guidance on platform design.7. Study new platform technology, including all IT equipment.【Server Mechanical and Thermal architect】1. Experienced in server thermal design and familiar with fan systems, heat sinks, and liquid cooling solutions.2. Expert in rack and data center cooling solution design.3. Familiar with all kinds of server system placements and chassis feature understanding.4. Familiar with OCP rack and thermal solutions.5. Capable of 3D modeling using tools such as Creo or SolidWorks.6. Capable of thermal simulations.7. Understand chassis and rack structure analysis.【BMC/BIOS firmware architect】1. Work with server vendors for BMC and BIOS coding and specification definitions.2. Familiar with OpenBMC.3. Modify BMC and provide TSMC proprietary RESTful APIs based on user requests.4. Work with storage software developers to define BMC's special roles in storage appliances.5. Communicate effectively with server vendors and provide guidance on BIOS/BMC design.Additional information for the job:Job Location: Hsinchu SiteThe complete interview process includes (●-Must-be assessment; ○-Optional assessment):●Manager interview, ○ HackerRank test, ●On-site personality and English test (which could be substituted with the result of an official English proficiency test), ●HR interview, ○Second manager interview, ● Technical review.

Job Responsibilities

Your responsibilities include:Candidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC/BIOS Firmware Architect.【Server Platform architect】1. Familiar with server CPU/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design.2. Experienced in server motherboard (MB), backplanes, and adapter boards design.3. Familiar with storage components' features and operations.4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards.5. Capable of debugging server hardware issues.6. Communicate effectively with server vendors and provide guidance on platform design.7. Study new platform technology, including all IT equipment.【Server Mechanical and Thermal architect】1. Experienced in server thermal design and familiar with fan systems, heat sinks, and liquid cooling solutions.2. Expert in rack and data center cooling solution design.3. Familiar with all kinds of server system placements and chassis feature understanding.4. Familiar with OCP rack and thermal solutions.5. Capable of 3D modeling using tools such as Creo or SolidWorks.6. Capable of thermal simulations.7. Understand chassis and rack structure analysis.【BMC/BIOS firmware architect】1. Work with server vendors for BMC and BIOS coding and specification definitions.2. Familiar with OpenBMC.3. Modify BMC and provide TSMC proprietary RESTful APIs based on user requests.4. Work with storage software developers to define BMC's special roles in storage appliances.5. Communicate effectively with server vendors and provide guidance on BIOS/BMC design.Additional information for the job:Job Location: Hsinchu SiteThe complete interview process includes (●-Must-be assessment; ○-Optional assessment):●Manager interview, ○ HackerRank test, ●On-site personality and English test (which could be substituted with the result of an official English proficiency test), ●HR interview, ○Second manager interview, ● Technical review.

Your responsibilities include:

Candidates only need to meet the qualifications of one of the three types below: Server Platform Architect, Server Mechanical and Thermal Architect, or BMC/BIOS Firmware Architect.

【Server Platform architect】

1. Familiar with server CPU/GPU platform design and provide all stakeholders with platform knowledge and propose the right solution for system design.

2. Experienced in server motherboard (MB), backplanes, and adapter boards design.

3. Familiar with storage components' features and operations.

4. Familiar with OCP DC-MHS standards and capable of defining TSMC HPM standards.

5. Capable of debugging server hardware issues.

6. Communicate effectively with server vendors and provide guidance on platform design.

7. Study new platform technology, including all IT equipment.