Engineer, NAND PI

As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
• Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production.
• Design Experiments: Design and implement device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Multi-functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across multi-functional teams to enable a project to proceed in a rapid and low error manner.
• Technology Transfer: Support the transfer of new technology from R&D to high volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on-job training and training class.

Successful candidates for this position will have:

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and capacity to collaborate within multi-functional teams.

Requirements:

Education:

• Bachelors or Masters or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• Basic understanding and knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in R&D and technology transfer within Semiconductor industry
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.