Electrical/Hardware Engineer 4

HpSuzhou, Jiangsu, China
ActiveVerified 42m ago

Job description

Responsibilities:

  • Construct the product system architecture with the ability to make interdisciplinary trade-offs to optimize for the best cost/performance/time.
  • Responsible for headset electrical detailed design (including test and debug) with cross-function team and ODM supplier, conduct design review before design release for production tooling
  • Define product requirements and specifications (mechanical, electrical, acoustic, firmware) and test document as necessary to ensure desired quality and performance of the product
  • Leading internal team of engineers (mechanical, electrical, acoustic, firmware) and work with ODM partners to complete products
  • Building an efficient communication bridge to ODM supplier with worldwide development teams across multiple disciplines (Product Manager, QA, Ops, 3rd party supplier etc.)
  • Provide global technical support to other non-engineering functions on key technologies and past, present, and future products
  • Develop new technologies/technology platforms

Requirements

  • 6 years+ experience in product development of electronic products, 2 years experience as a team leader or leading ODM projects is a must.
  • Bachelor degree+ in electrical engineering discipline or similar.
  • Strong consumer electronic industrial background. Wireless and audio working experience will be a plus.
  • Rich design experience for high volume manufacture of consumer electronic product.
  • EDA experience in validating schematic and PCB/A layout, prototype bring-up and debugging between Engineering team and ODM, lead team to meet requirement of EMC/EMI, ESD, RF, reliability etc.
  • Thorough understanding of, and ability to clearly explain, EE concepts such as A/D, DC/DC supply, RF gain compression, EMI noise suppression techniques, SWR and power measurement
  • Strong electrical engineering background with clear understanding of software/firmware development. Track record of learning and understanding other engineering disciplines (software, firmware, mechanical, acoustic)
  • Broad exposure to many engineering disciplines: Electrical, Mechanical, Software, Systems, Acoustics
  • Strong written and oral communication skills in both English and Mandarin, and strong interpersonal skills
  • Ability to work with others in a widely-disbursed, fast-paced team environment
  • Excellent time management and organizational skills

Highly Disirerable

  • Experience/knowledge of RF design and antenna design for wireless systems
  • Experience /knowledge of embedded system design and coding
  • Experience working with global engineering team and product management to define products and make tradeoffs
  • Experience mentoring junior engineers for technical skills and soft skills