Electrical Hardware Design Engineer

Electrical Hardware Design Engineer (High-Speed Imaging Systems) | Piscataway, NJJoin a global leader in scientific instrumentation to design advanced light detection and imaging systems. This role focuses on the development of high-speed, mixed-signal electronics for precision scientific applications in industries such as medical diagnostics, semiconductor manufacturing, and biotech. Key ResponsibilitiesHardware Development: Lead the design and development of mixed-signal circuit boards for high-speed imaging systems incorporating CCD, CMOS, and InGaAs sensors.Mixed-Signal Design: Design precision analog front-end circuits using Op-Amps, DACs, ADCs, and voltage references for sensitive sensor conditioning.Digital Systems: Develop FPGA-based high-speed digital circuitry utilizing LVDS and MIPI interfaces for sensor command and control.PCB Guidance: Direct multi-layer PCB designs, including stack-up definition, component placement, and routing strategies for signal integrity.Lifecycle Support: Contribute to all product phases, from initial definition and prototyping to validation, troubleshooting, and production support.Requirements QualificationsExperience: 6–10 years of direct experience with a BSEE, or 12+ years of equivalent design experience in precision instrumentation.Technical Mastery: Expertise in low-noise/wide-bandwidth analog design and high-speed data acquisition (USB 2/3, Gig-E, SPI, I2C).Tools & Skills: Proficiency with lab equipment (Oscilloscopes, Spectrum Analyzers) and FPGA tools (Verilog/VHDL, Xilinx/Altera).Education: BSEE required; an advanced degree (MSEE) is preferred.BenefitsSalary: $120k – $150k DOEBenefits: Excellent benefits, bonus, and work advancement opportunities. Work Style: OnsiteElectrical Hardware Design Engineer (High-Speed Imaging Systems) | Piscataway, NJJoin a global leader in scientific instrumentation to design advanced light detection and imaging systems. This role focuses on the development of high-speed, mixed-signal electronics for precision scientific applications in industries such as medical diagnostics, semiconductor manufacturing, and biotech. Key ResponsibilitiesHardware Development: Lead the design and development of mixed-signal circuit boards for high-speed imaging systems incorporating CCD, CMOS, and InGaAs sensors.Mixed-Signal Design: Design precision analog front-end circuits using Op-Amps, DACs, ADCs, and voltage references for sensitive sensor conditioning.Digital Systems: Develop FPGA-based high-speed digital circuitry utilizing LVDS and MIPI interfaces for sensor command and control.PCB Guidance: Direct multi-layer PCB designs, including stack-up definition, component placement, and routing strategies for signal integrity.Lifecycle Support: Contribute to all product phases, from initial definition and prototyping to validation, troubleshooting, and production support.

Electrical Hardware Design Engineer (High-Speed Imaging Systems) | Piscataway, NJ

Electrical Hardware Design Engineer (High-Speed Imaging Systems) | Piscataway, NJElectrical Hardware Design Engineer (High-Speed Imaging Systems) | Piscataway, NJ

Join a global leader in scientific instrumentation to design advanced light detection and imaging systems. This role focuses on the development of high-speed, mixed-signal electronics for precision scientific applications in industries such as medical diagnostics, semiconductor manufacturing, and biotech.

Join a global leader in scientific instrumentation to design advanced light detection and imaging systems. This role focuses on the development of high-speed, mixed-signal electronics for precision scientific applications in industries such as medical diagnostics, semiconductor manufacturing, and biotech.

Key Responsibilities

Key ResponsibilitiesKey Responsibilities

• Hardware Development: Lead the design and development of mixed-signal circuit boards for high-speed imaging systems incorporating CCD, CMOS, and InGaAs sensors.

Hardware Development:Hardware Development:Lead the design and development of mixed-signal circuit boards for high-speed imaging systems incorporating CCD, CMOS, and InGaAs sensors.

• Mixed-Signal Design: Design precision analog front-end circuits using Op-Amps, DACs, ADCs, and voltage references for sensitive sensor conditioning.

Mixed-Signal Design:Mixed-Signal Design:Design precision analog front-end circuits using Op-Amps, DACs, ADCs, and voltage references for sensitive sensor conditioning.

• Digital Systems: Develop FPGA-based high-speed digital circuitry utilizing LVDS and MIPI interfaces for sensor command and control.

Digital Systems:Digital Systems:Develop FPGA-based high-speed digital circuitry utilizing LVDS and MIPI interfaces for sensor command and control.

• PCB Guidance: Direct multi-layer PCB designs, including stack-up definition, component placement, and routing strategies for signal integrity.

PCB Guidance:PCB Guidance:Direct multi-layer PCB designs, including stack-up definition, component placement, and routing strategies for signal integrity.

• Lifecycle Support: Contribute to all product phases, from initial definition and prototyping to validation, troubleshooting, and production support.

Lifecycle Support:Lifecycle Support:Contribute to all product phases, from initial definition and prototyping to validation, troubleshooting, and production support.