Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

Req. ID: JR87522 Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Leading innovation in Dry Etch technology and essential module advancement * Develop and innovate dry etch processes to meet structural and electrical specifications. * Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. * Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes. * Collaborate and lead cross-functional teams to solve complex structural problems. * Present process and technology roadmaps for current and future technology nodes. * Proactively predict when and how a future issue could arise and build mitigation plans. * Contribute towards the Technical Leadership Program. * Mentor less experienced engineers and encourage skills within the team. * Be associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase. ## Collaboration with other Process Areas * Find opportunities and drive towards a collaborative solution. * Guide other areas on technology roadmaps. * Lead or be part of cross-functional task force groups driving towards a target. * Drive towards general expertise in other areas' process hardware or technologies. ## Interaction with Dry Etch peers * Serve as a resource and mentor for colleagues in dry etch technology and/or project management. * Provide critical updates to upper management on project status and impacts. ## Successful candidates for this position will have: * Demonstrated interest in research and development environment. * 6-10 years’ experience in dry etch process development in R&D moving into manufacturing. * 4-5 years of applicable NAND, DRAM, or Logic module development experience, for example: projects and deliveries involving cross-functional teams. * Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework. * Demonstrated leadership in problem-solving. Experience in managing technical projects. * Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries). * Expertise in statistical process control and analysis. * Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes. * Lead supplier head-to-heads. * Data science basics/Python coding/AI coders shall be preferred over candidates without this experience. * Strong computer skills, including MS Office, and SAS software like JmP oe similar. ## Education * Masters/PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering, or related fields, along with at least 6 years of pertinent dry etch process development experience. * Bachelors/Masters (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering or related fields) with at least 10 years of pertinent dry etch process development experience. Job Profile(s): Semiconductor Process Eng (Supervisory) 5 - Semiconductor Process Eng MTS Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.