Advance Packaging Process Development Engineer

Req. ID: JR100470 Advance Packaging Process Development Engineer Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This is a junior-level role, intended for fresh graduates or candidates with under 2 years of experience.該職缺開放給畢業生及兩年以下工作經驗者 JOB DESCRIPTION: Micron’s Assembly Package Process Development team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron’s memory products ramp up including side by side certification with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly process guideline rules working closely with Design teams (Globally) and you will be involved in the running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An importance of this role is process capability of innovative package technology: Deep fundamental understanding of the key risks in Bumping, TSV (Through-Silicon Via) packaging technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands on integration experience in Package Assembly and Wafer Level package process are needed. JOB REQUIREMENT * 0-2 years of experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes. Experience with High Bandwidth Memory (HBM) integration is a plus. * Education: Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field. PhD / Masters Degree is preferred * Technical Experience: Development experience in one or more areas of Photo, Physical Vapor Deposition (PVD),Chemical Vapor Deposition (CVD), Chemical Mechanical Planarization (CMP), wafer level molding, wafer level ball mount, Thermo-Compression Bonding (TCB), Flip Chip (FC), Underfill (UF), Hybrid bond, Glass carrier bond/ de-bond is a plus * Problem-Solving Abilities: Strong analytical and problem-solving skills, with the ability to troubleshoot issues and optimize process parameters. * Communication Skills: Effective verbal and written communication skills, with the ability to communicate clearly and professionally with team members and stakeholders * Adaptability: Ability to work effectively in a fast-paced and dynamic environment, with the flexibility to work with global teams across different time zones * Team Player: Collaborative mindset with a willingness to work closely with cross-functional teams to achieve common goals. Inclusion & Accessibility Statement Micron is committed to fair, inclusive, and merit‑based hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply. Values Alignment Successful candidates are expected to embody Micron’s core values: * People – Respect, develop, and empower others * Innovation – Drive continuous improvement and breakthrough thinking * Tenacity – Demonstrate accountability and perseverance * Collaboration – Build trust and work as one team * Customer Focus – Deliver excellence and value AI Relevant Job Responsibilities: \- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. \- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. \- Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business Job Profile(s): Product Development Engineer 1 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.